BGA IR stanica INFRA 2001B

YIHUA 1000B Infrared Used Bga Rework Station &nbsp| Feature &nbsp| 1. Using the newSAMSUNG microcomputer processor PIDprogrammable temperature control technology and uses an infrared source and optics to target heat to individual components without dislodging other SMT parts by way of eddies air currents. 2. Adoptinfrared weld technologywhich independent exploration, infrared penetration strength, components uniform heating, beyond the traditional hot air heating vowed to prevent blow off the IC surrounding small components. 3.Technician focused infrared heatis easy to target most component removal/replacement and re-work. 4. Infrared heat source bulbs arelong-lived, un-expensive and easily replaced. 5. Has bright delicate,low voltage LED lighting, safety and energy conservation. 6.It hasExternal Sensor Temperature control mode, that is detected by the sensor IC surface temperature control temperature,this function is good for freshman operation ,it’s safe way protectcomponents . 7.MountTechnology (SMT) components 15-35cm in size. 8. This machine has 540W heating system , widely to 120mm*120mm. 9.Preheating plate color is black,from the photics point of view, black coloreasy to absorb heating, shorten the warm-up time. 10. Powerful human function design, with the following functions A.Temperature correction function Correction of temperature range:-50°C~+50 °C(Infrared lamp analog value :580). B.Celsius / Fahrenheit temperature display function 11. This machine also havehot air reworks and soldering iron function, if you have the device ,you can used for all of the components solder ,desoldering ,preheating ,repair all components ,especially Micro BGA components. &nbsp| &nbsp| YIHUA 1000B Infrared Used Bga Rework Station &nbsp| Technical Data &nbsp| voltage AC220V ± 10% Maxpowerconsumption 1415W &nbsp| Preheating Station Parts &nbsp| Maxpowerconsumption 540W Light-emittingcomponents Farinfraredheatingplate TemperatureRange 50°C-300°C / 122°F~572°F or 50°C~200°C/122°F~488°F DisplayType LED Preheatingarea 120 * 120mm &nbsp| Infrared Lamp Part &nbsp| Maxpowerconsumption 150W Light-emittingcomponents Infraredemissionlamp TemperatureRange 100°C-350°C / 212°F~662°F TemperatureStability ± 1°C DisplayType LED Effectiveirradiationarea 35 * 35mm Come with 2 lens cup, you can be choice two of lens cup from 28mm/ 38mm / 48mm. &nbsp| Soldering Station Part &nbsp| Maxpowerconsumption 75W Heatingcomponents importedheater TemperatureRange 100°C – 480°C / 392°F ~ 896°F TemperatureStability ± 1°C (statics) Tipofgroundvoltage &lt| 2mV Tipgroundimpedance&lt| 2ohm DisplayType LEDDisplay Handlecablelength &#8805|100cm &nbsp| HotAirReworks Part &nbsp| Maxpowerconsumption 700W HeatingcomponentsSkeleton-typeceramicheater Airflowtype Brushlessfanspiralwind AirFlow &#8804| 130L / min TemperatureRange 200°C-480°C / 212°F~896°F TemperatureStability ± 1°C (statics) DisplayType LED Handlecablelength &#8805|100cm &nbsp| &nbsp| YIHUA 1000B infrared Used Bga Rework Station &nbsp| &nbsp| &nbsp| &nbsp| YIHUA 1000B Infrared Used Bga Rework StationOperation InfraredBGA Rework Station &nbsp| NOTICE &nbsp| 1.Repair circuit boards required precautions and necessary protective measures 1 ) To ensure that both sides of the circuit board preheat zone without fusible explosive flammable components,like:Plastic,Display,Phone camera,LED,Electrolytic capacitors 2 ) Ensure that no combustible fusible explosive components in Infrared light can shine on the area. If you can not avoid,Must use reflective paper keep out that. like:Plastic,Display,Phone camera,LED,Electrolytic capacitors. &nbsp| 2.According to IC size, use a suitable diameter lamp cup(lamp cup size larger than IC size)| Install lights Cup minimize the distance between lamp and IC, to facilitates heating. &nbsp| 3. Ensure that the working environment is no greater airflow to prevent heat loss,well sheltered measures when necessary. &nbsp| 4. Apply solder paste to the IC before the de-soldering,also you can early preheat then Apply solder paste,Especially BGA package IC,should be early preheat then apply solder paste,the can make solder paste penetrate into the bottom of the IC. &nbsp| 5.Wear heat protective gloves and goggles. Place the visor, good shading measures to protect the eyes. &nbsp| 6. Turn on the Infrared light power,Set the temperature to about 280°C.Make the appropriate adjustments based on the size of the IC and circuit board. IC by infrared light irradiation will be rapidly warming (generally 1 to 3 minutes) . &nbsp| 7. Just started using this product, it is best to try to use the abandoned circuit board rework a few times. and so familiar with the use of this product ,then carry out normal maintenance work. &nbsp| &nbsp| Usage &nbsp| 1).SuitablefordesolderingandsolderingBGA,SOIC,CHIP,QFP,PLCCpackageSMDIC, ParticularlysuitablefordesolderingBGAmodule,computermotherboardnorthandsouthbridge, allkindsofmobilephonemotherboard SMTICandLEDlights. &nbsp| 2).Shrinking,Paintdrying,adhesiveremoval,thawing,warming,Plasticweldingetc. &nbsp| &nbsp| Packing List &nbsp| Machine X 1 soldering iron handle X 1 sodering iron holder X1 air gun handle X 1 air gun holder X 1 Filtered light Sheet X 1 Infrared light cup X 2 (diameter:30MM ,40MM) Infrared lamp X 1 Nozzel (Big ,medium, small ,square) X 1 Interface cable X 1 Test cable X 1 IC pick-up X 1 PCB holder X 1 Power cord X 1 Instruction manual X 1